If a language is selected at the box above this line you will see page translation via google translate
Do not use google translate if there is a native translation existent of the page - try a look at the little flag at the right top of every page!
.

Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revision Previous revision
en:ovi40build:uiboardbuild [19.02.2018 18:20]
df9ts
en:ovi40build:uiboardbuild [02.03.2018 18:13] (current)
df9ts_user
Line 1: Line 1:
-{{tag>​english}}{{tag>​publish}} 
- 
-===== Building the UI V1.8 Board ===== 
- 
-==== OVI40 UI V1.7 Documents ==== 
- 
-**UI V1.7 documents are provided for information only**. Please primarily use the V1.8 documents for building the UI V1.8 board. 
- 
-   * {{:​projekte:​ovi40-sdr:​uhsdr_ovi40_ui_v17_sheet.pdf|OVI40 UI V1.7 schematics}} 
-   * {{:​projekte:​ovi40-sdr:​uhsdr_ui_ovi40_bst_bot_layer_17.pdf|UI V1.7 component placement - bottom layer}} 
-   * {{:​projekte:​ovi40-sdr:​uhsdr_ui_ovi40_bst_top_layer_17.pdf|UI V1.7 component placement - top layer}} 
- 
-Please note that the component placement docs are searchable pdf documents. During soldering they can be used to quickly find a component'​s location by entering the component reference (e.g. "​R20"​) in pdf search. No need to be concerned to use the V1.7 component placement doc for assembling a V1.8 UI board - V1.7 and V1.7 are quite similar in this respect. 
- 
-==== OVI40 UI V1.8 Documents ==== 
- 
-  * {{:​projekte:​ovi40-sdr:​uhsdr_ovi40_ui_18_sheet.pdf|OVI40 UI V1.8 schematics}} 
-  * [[en:​projekte:​ovi40-sdr:​bom|OVI40 UI V1.8 BOM]] 
-  * {{:​ovi40build:​parts-installation_2_ui_v1.8a.pdf |BOM von Francois F4HTX with IC Device Marks added}} 
- 
-==== OVI40 UI V1.8 Kit Contents ==== 
- 
-The kit contains UI V1.8 PCB, components in bags and packing list. The display is delivered as assembled and tested unit. 
- 
-|< 60% 33% 33% 33% >| 
-|[{{:​projekte:​ovi40-sdr:​i40_20.jpg?​150|Components in bags (Foto: DL8EBD)}}]|[{{:​projekte:​ovi40-sdr:​i40_22.jpg?​150|UI V1.8 PCB (Foto: DL8EBD)}}]|[{{:​projekte:​ovi40-sdr:​i40_21.jpg?​150|Display board (Foto: DL8EBD)}}]| 
- 
-==== Assembly and Soldering ==== 
- 
-The graphics below - UI V1.7 with 3.2" Display - give an impression on how the finished V1.8 UI board will look like: 
- 
-|< 95% 50% 50% >| 
- 
-|  [{{:​ovi40build:​ui_top_3d.png?​400|UI Board V1.7 mit 3.2" Display)}}] ​ |  [{{:​ovi40build:​ui_bottom_3d.png?​400|UI Board V1.7}}] ​ | 
- 
-=== Please read Errata carefully === 
- 
-Make sure to read the [[en:​ovi40build:​batch1uiboarderrata|Errata]] carefully **before starting assembly.** 
- 
-<​code>​ 
-  === IC Device Markings === 
-</​code>​ 
- 
-The smaller ICs can be identified by device mark. The following device marks are used: 
- 
-|< 45% 25% 25% 25% 25% >| 
- 
-|Typ  |Device Mark  |Schematic ​ |Purpose ​ | 
-|LP5907_Q1 ​ |LLVB  |IC3  |LDO 3.3 V  | 
-|BAV70 ​ |A4  |D5, D6  |Diode ​ | 
-|BC857B ​ |3F  |T3  |Transistor| 
-|BAS85 ​ |Ring = Cathode|D7 - D9  |Diode ​ | 
- 
-=== MCU STM32 "Pin 1" marking === 
- 
-Please understand the correct orientation of STM32 MCU Pin 1. There are two markings on the IC. Please not the text printed on MCU to find the correct Pin 1: When reading the text Pin 1 is on bottom left corner. 
- 
-[{{:​projekte:​ovi40-sdr:​ui-i40-cpu.jpg?​400| Orientation of TXCO & MCU (photo DF9EH)}}] 
- 
-<​code>​ 
-  === STM32F76X_ZIT vs. STM32H743ZIT6 === 
-</​code>​ 
- 
-The kit is shipped with STM32F76X_ZIT ("​F7"​). The just released STM32H743ZIT6 ("​H7"​) may be used instead. It is suggested to use the F7 for now. Rwason: it is planned to support the H7 in the UHSDR, but no boot loader oder firmware is released for the H7 at the moment. 
- 
-Comparison of MCUs: 
- 
-|< 90% 25% 25% 25% 25% >| 
- 
-|   ​|mcHF: ​ |OVI40: ​ |OVI40 - future: ​ | 
-|   ​|STM32F407VET6|STM32F767ZIT6|STM32H743ZIT6 ​ | 
-|Flash[kB] ​ |500  |2048  |2048  | 
-|RAM [kB]  |192  |512  |1024  | 
-|Clock[MHz] ​ |168  |216  |400  | 
-|FPU  |single ​ |double ​ |double ​ | 
-|Pins  |100  |144  |144  | 
-|DMIPS ​ |210  |462  |856  | 
- 
-=== EEPROM IC7 orientation === 
- 
-[{{:​ovi40test:​ic7_einbau.jpg?​400|EEPROM IC7 position (photo DF9EH)}}] 
- 
-This is where the dot is printed. Also the edge of the case is slanted near the 1-4 pins. See [[http://​ww1.microchip.com/​downloads/​en/​DeviceDoc/​Atmel-8828-SEEPROM-AT24CM02-Datasheet.pdf|here]] 
- 
-[{{:​fr:​ovi40build:​20180211_144354_2.jpg?​400|IC7 close-up}}] 
- 
-**Do not solder in R101** for the EEPROM delivered with the kit (AT24CM02). 
- 
-=== Prevent short cut with back up battery holder === 
- 
-One of the connection pins of the battery holder might touch ground connection of a rotary encoder. Make sure to cut this pin flush with PCB surface **before soldering** ​ - see photo: 
- 
-[{{:​projekte:​ovi40-sdr:​batt_halter.jpg?​400|Potential Shortcut (photo DF9EH)}}] 
- 
-=== Polarised capacitors === 
- 
-Please observe mounting orientation of tantal and electrolytic capacitors. Markings on the capacitors are explained [[http://​elektroniktutor.de/​bauteilkunde/​c_smdcod.html|http://​elektroniktutor.de/​bauteilkunde/​c_smdcod.html|here]] 
- 
-=== Mounting locations of switches S7 and S8 === 
- 
-Two different mounting locations are provided on the UI PCB for S7 and S8: 
- 
-  * "mcHF style":​ S7 and S8 not line with switches under LCD - they are mounted slightly higher 
-  * "OVI40 style":​ S7 and S8 are mounted in line with the function keys under the LCD 
- 
-"In line" is the preferred mounting location for S7 and S8. 
- 
-=== IC9 und IC11: leave empty for now === 
-IC9 (SPI FRAM) and IC11 (SPI FLASH) are for future use. Please leave empty for now. They are neither required nor supported by UHSDR at this time. 
- 
-==== Device Electronic Signature ==== 
-=== STM32F76xxx === 
-  * 0x111: STM32F767 and STM32F777 LQFP208 and TFBGA216 package 
-  * 0x110: STM32F769 and STM32F779 LQFP208 and TFBGA216 package 
-  * 0x101: STM32F767 and STM32F777 LQFP176 package 
-  * 0x100: STM32F769 and STM32F779 LQFP176 package 
-  * 0x011: WLCSP180 package 
-  * 0x010: LQFP144 package 
-  * 0x001: LQFP100 package 
-  * 0x000: Reserved 
-\\ 
-=== STM32H7x3 MCUs: === 
-  * 0000: LQFP100 (STM32H7x3) 
-  * 0010: TQFP144 (STM32H7x3) 
-  * 0101: TQFP176/​UFBGA176 (STM32H7x3) 
-  * 1000: LQFP208/​TFBGA240 (STM32H7x3) 
- 
 ==== Modifications ==== ==== Modifications ====
  
 === Temporary Modification:​ Resistor in parallel to C94 === === Temporary Modification:​ Resistor in parallel to C94 ===
  
-Symptom: In stand-by the current drawn from back-up battery is excessively high. Work-around:​ Put resistor in parallel to C94. Start with a value of 56k - this seems to work in most cases. If board does not start increase value slightly. The same approach is used BTW in the commercially available Disco F746 prototype board. ​+Symptom: In stand-by the current drawn from back-up battery is excessively high. Work-around:​ Put resistor in parallel to C94. Start with a value of 56k - this seems to work in most cases. If board does not start increase value slightly. The same approach is used BTW in the commercially available Disco F746 prototype board.
  
 === Change brightness of LEDs === === Change brightness of LEDs ===
Line 139: Line 12:
   * R37 auf 6,8k (D2 rot)   * R37 auf 6,8k (D2 rot)
   * R116 auf 6,8k (D3 blau)   * R116 auf 6,8k (D3 blau)
- 
-\\