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en:ovi40build:uiboardbuild [19.02.2018 18:20] – df9ts | en:ovi40build:uiboardbuild [02.03.2018 18:13] (current) – df9ts_user | ||
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- | {{tag> | ||
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- | ===== Building the UI V1.8 Board ===== | ||
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- | ==== OVI40 UI V1.7 Documents ==== | ||
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- | **UI V1.7 documents are provided for information only**. Please primarily use the V1.8 documents for building the UI V1.8 board. | ||
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- | * {{: | ||
- | * {{: | ||
- | * {{: | ||
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- | Please note that the component placement docs are searchable pdf documents. During soldering they can be used to quickly find a component' | ||
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- | ==== OVI40 UI V1.8 Documents ==== | ||
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- | * {{: | ||
- | * [[en: | ||
- | * {{: | ||
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- | ==== OVI40 UI V1.8 Kit Contents ==== | ||
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- | The kit contains UI V1.8 PCB, components in bags and packing list. The display is delivered as assembled and tested unit. | ||
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- | |< 60% 33% 33% 33% >| | ||
- | |[{{: | ||
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- | ==== Assembly and Soldering ==== | ||
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- | The graphics below - UI V1.7 with 3.2" Display - give an impression on how the finished V1.8 UI board will look like: | ||
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- | |< 95% 50% 50% >| | ||
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- | | [{{: | ||
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- | === Please read Errata carefully === | ||
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- | Make sure to read the [[en: | ||
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- | < | ||
- | === IC Device Markings === | ||
- | </ | ||
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- | The smaller ICs can be identified by device mark. The following device marks are used: | ||
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- | |< 45% 25% 25% 25% 25% >| | ||
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- | |Typ |Device Mark |Schematic | ||
- | |LP5907_Q1 | ||
- | |BAV70 | ||
- | |BC857B | ||
- | |BAS85 | ||
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- | === MCU STM32 "Pin 1" marking === | ||
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- | Please understand the correct orientation of STM32 MCU Pin 1. There are two markings on the IC. Please not the text printed on MCU to find the correct Pin 1: When reading the text Pin 1 is on bottom left corner. | ||
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- | [{{: | ||
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- | < | ||
- | === STM32F76X_ZIT vs. STM32H743ZIT6 === | ||
- | </ | ||
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- | The kit is shipped with STM32F76X_ZIT (" | ||
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- | Comparison of MCUs: | ||
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- | |< 90% 25% 25% 25% 25% >| | ||
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- | | | ||
- | | | ||
- | |Flash[kB] | ||
- | |RAM [kB] |192 |512 |1024 | | ||
- | |Clock[MHz] | ||
- | |FPU |single | ||
- | |Pins |100 |144 |144 | | ||
- | |DMIPS | ||
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- | === EEPROM IC7 orientation === | ||
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- | [{{: | ||
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- | This is where the dot is printed. Also the edge of the case is slanted near the 1-4 pins. See [[http:// | ||
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- | [{{: | ||
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- | **Do not solder in R101** for the EEPROM delivered with the kit (AT24CM02). | ||
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- | === Prevent short cut with back up battery holder === | ||
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- | One of the connection pins of the battery holder might touch ground connection of a rotary encoder. Make sure to cut this pin flush with PCB surface **before soldering** | ||
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- | [{{: | ||
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- | === Polarised capacitors === | ||
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- | Please observe mounting orientation of tantal and electrolytic capacitors. Markings on the capacitors are explained [[http:// | ||
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- | === Mounting locations of switches S7 and S8 === | ||
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- | Two different mounting locations are provided on the UI PCB for S7 and S8: | ||
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- | * "mcHF style": | ||
- | * "OVI40 style": | ||
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- | "In line" is the preferred mounting location for S7 and S8. | ||
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- | === IC9 und IC11: leave empty for now === | ||
- | IC9 (SPI FRAM) and IC11 (SPI FLASH) are for future use. Please leave empty for now. They are neither required nor supported by UHSDR at this time. | ||
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- | ==== Device Electronic Signature ==== | ||
- | === STM32F76xxx === | ||
- | * 0x111: STM32F767 and STM32F777 LQFP208 and TFBGA216 package | ||
- | * 0x110: STM32F769 and STM32F779 LQFP208 and TFBGA216 package | ||
- | * 0x101: STM32F767 and STM32F777 LQFP176 package | ||
- | * 0x100: STM32F769 and STM32F779 LQFP176 package | ||
- | * 0x011: WLCSP180 package | ||
- | * 0x010: LQFP144 package | ||
- | * 0x001: LQFP100 package | ||
- | * 0x000: Reserved | ||
- | \\ | ||
- | === STM32H7x3 MCUs: === | ||
- | * 0000: LQFP100 (STM32H7x3) | ||
- | * 0010: TQFP144 (STM32H7x3) | ||
- | * 0101: TQFP176/ | ||
- | * 1000: LQFP208/ | ||
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==== Modifications ==== | ==== Modifications ==== | ||
=== Temporary Modification: | === Temporary Modification: | ||
- | Symptom: In stand-by the current drawn from back-up battery is excessively high. Work-around: | + | Symptom: In stand-by the current drawn from back-up battery is excessively high. Work-around: |
=== Change brightness of LEDs === | === Change brightness of LEDs === | ||
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* R37 auf 6,8k (D2 rot) | * R37 auf 6,8k (D2 rot) | ||
* R116 auf 6,8k (D3 blau) | * R116 auf 6,8k (D3 blau) | ||
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- | \\ | ||