Differences
This shows you the differences between two versions of the page.
Both sides previous revision Previous revision Next revision | Previous revisionLast revisionBoth sides next revision | ||
en:ovi40build:uiboardbuild [25.01.2018 15:48] – df9ts | en:ovi40build:uiboardbuild [19.02.2018 18:20] – df9ts | ||
---|---|---|---|
Line 1: | Line 1: | ||
- | {{tag>review}} | + | {{tag>english}}{{tag> |
===== Building the UI V1.8 Board ===== | ===== Building the UI V1.8 Board ===== | ||
Line 16: | Line 16: | ||
* {{: | * {{: | ||
- | * [[: | + | |
- | * {{:projekte: | + | * {{:ovi40build: |
==== OVI40 UI V1.8 Kit Contents ==== | ==== OVI40 UI V1.8 Kit Contents ==== | ||
Line 23: | Line 23: | ||
The kit contains UI V1.8 PCB, components in bags and packing list. The display is delivered as assembled and tested unit. | The kit contains UI V1.8 PCB, components in bags and packing list. The display is delivered as assembled and tested unit. | ||
+ | |< 60% 33% 33% 33% >| | ||
|[{{: | |[{{: | ||
Line 35: | Line 36: | ||
=== Please read Errata carefully === | === Please read Errata carefully === | ||
- | Make sure to read the [[: | + | Make sure to read the [[en: |
< | < | ||
Line 81: | Line 82: | ||
This is where the dot is printed. Also the edge of the case is slanted near the 1-4 pins. See [[http:// | This is where the dot is printed. Also the edge of the case is slanted near the 1-4 pins. See [[http:// | ||
+ | |||
+ | [{{: | ||
+ | |||
+ | **Do not solder in R101** for the EEPROM delivered with the kit (AT24CM02). | ||
=== Prevent short cut with back up battery holder === | === Prevent short cut with back up battery holder === | ||
Line 100: | Line 105: | ||
"In line" is the preferred mounting location for S7 and S8. | "In line" is the preferred mounting location for S7 and S8. | ||
+ | |||
+ | === IC9 und IC11: leave empty for now === | ||
+ | IC9 (SPI FRAM) and IC11 (SPI FLASH) are for future use. Please leave empty for now. They are neither required nor supported by UHSDR at this time. | ||
+ | |||
+ | ==== Device Electronic Signature ==== | ||
+ | === STM32F76xxx === | ||
+ | * 0x111: STM32F767 and STM32F777 LQFP208 and TFBGA216 package | ||
+ | * 0x110: STM32F769 and STM32F779 LQFP208 and TFBGA216 package | ||
+ | * 0x101: STM32F767 and STM32F777 LQFP176 package | ||
+ | * 0x100: STM32F769 and STM32F779 LQFP176 package | ||
+ | * 0x011: WLCSP180 package | ||
+ | * 0x010: LQFP144 package | ||
+ | * 0x001: LQFP100 package | ||
+ | * 0x000: Reserved | ||
+ | \\ | ||
+ | === STM32H7x3 MCUs: === | ||
+ | * 0000: LQFP100 (STM32H7x3) | ||
+ | * 0010: TQFP144 (STM32H7x3) | ||
+ | * 0101: TQFP176/ | ||
+ | * 1000: LQFP208/ | ||
==== Modifications ==== | ==== Modifications ==== | ||
Line 105: | Line 130: | ||
=== Temporary Modification: | === Temporary Modification: | ||
- | Symptom: In stand-by the current drawn from back-up battery is excessively high. Work-around: | + | Symptom: In stand-by the current drawn from back-up battery is excessively high. Work-around: |
=== Change brightness of LEDs === | === Change brightness of LEDs === |