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en:ovi40build:uiboardbuild [25.01.2018 08:27] – Initial draft - assembly page df9tsen:ovi40build:uiboardbuild [19.02.2018 18:20] – df9ts
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-{{tag>stub}}+{{tag>english}}{{tag>publish}} 
 ===== Building the UI V1.8 Board ===== ===== Building the UI V1.8 Board =====
  
 ==== OVI40 UI V1.7 Documents ==== ==== OVI40 UI V1.7 Documents ====
 +
 **UI V1.7 documents are provided for information only**. Please primarily use the V1.8 documents for building the UI V1.8 board. **UI V1.7 documents are provided for information only**. Please primarily use the V1.8 documents for building the UI V1.8 board.
  
-{{:projekte:ovi40-sdr:uhsdr_ovi40_ui_v17_sheet.pdf|OVI40 UI V1.7 schematics}} +   * {{:projekte:ovi40-sdr:uhsdr_ovi40_ui_v17_sheet.pdf|OVI40 UI V1.7 schematics}} 
-{{:projekte:ovi40-sdr:uhsdr_ui_ovi40_bst_bot_layer_17.pdf|UI V1.7 component placement - bottom layer}} +   * {{:projekte:ovi40-sdr:uhsdr_ui_ovi40_bst_bot_layer_17.pdf|UI V1.7 component placement - bottom layer}} 
-{{:projekte:ovi40-sdr:uhsdr_ui_ovi40_bst_top_layer_17.pdf|UI V1.7 component placement - top layer}}+   * {{:projekte:ovi40-sdr:uhsdr_ui_ovi40_bst_top_layer_17.pdf|UI V1.7 component placement - top layer}}
  
-Please note that the component placement docs are searchable pdf documents. During soldering they can be used to quickly find a component's location by entering the component reference (e.g. "R20") in pdf search. +Please note that the component placement docs are searchable pdf documents. During soldering they can be used to quickly find a component's location by entering the component reference (e.g. "R20") in pdf search. No need to be concerned to use the V1.7 component placement doc for assembling a V1.8 UI board - V1.7 and V1.7 are quite similar in this respect.
  
 ==== OVI40 UI V1.8 Documents ==== ==== OVI40 UI V1.8 Documents ====
  
-{{:projekte:ovi40-sdr:uhsdr_ovi40_ui_18_sheet.pdf|OVI40 UI V1.8 schematics}}  +  * {{:projekte:ovi40-sdr:uhsdr_ovi40_ui_18_sheet.pdf|OVI40 UI V1.8 schematics}} 
-[[:projekte:ovi40-sdr:bom|OVI40 UI V1.8 BOM]] +  * [[en:projekte:ovi40-sdr:bom|OVI40 UI V1.8 BOM]] 
-{{:projekte:ovi40-sdr:parts-installation_2_ui_v1.8.pdf|BOM created by Francois F4HTX with additional info}}+  * {{:ovi40build:parts-installation_2_ui_v1.8a.pdf |BOM von Francois F4HTX with IC Device Marks added}}
  
 ==== OVI40 UI V1.8 Kit Contents ==== ==== OVI40 UI V1.8 Kit Contents ====
Line 21: Line 23:
 The kit contains UI V1.8 PCB, components in bags and packing list. The display is delivered as assembled and tested unit. The kit contains UI V1.8 PCB, components in bags and packing list. The display is delivered as assembled and tested unit.
  
-|[{{:projekte:ovi40-sdr:i40_20.jpg?150|Components in bags (Foto: DL8EBD)}}]|[{{:projekte:ovi40-sdr:i40_22.jpg?150|UI V1.8 PCB (Foto: DL8EBD)}}]|[{{:projekte:ovi40-sdr:i40_21.jpg?150|Display board, normally assembled. Here photo shows non-standard kit for self soldering (Foto: DL8EBD)}}]|+|< 60% 33% 33% 33% >| 
 +|[{{:projekte:ovi40-sdr:i40_20.jpg?150|Components in bags (Foto: DL8EBD)}}]|[{{:projekte:ovi40-sdr:i40_22.jpg?150|UI V1.8 PCB (Foto: DL8EBD)}}]|[{{:projekte:ovi40-sdr:i40_21.jpg?150|Display board (Foto: DL8EBD)}}]|
  
 ==== Assembly and Soldering ==== ==== Assembly and Soldering ====
  
 The graphics below - UI V1.7 with 3.2" Display - give an impression on how the finished V1.8 UI board will look like: The graphics below - UI V1.7 with 3.2" Display - give an impression on how the finished V1.8 UI board will look like:
 +
 |< 95% 50% 50% >| |< 95% 50% 50% >|
 +
 |  [{{:ovi40build:ui_top_3d.png?400|UI Board V1.7 mit 3.2" Display)}}]  |  [{{:ovi40build:ui_bottom_3d.png?400|UI Board V1.7}}]  | |  [{{:ovi40build:ui_top_3d.png?400|UI Board V1.7 mit 3.2" Display)}}]  |  [{{:ovi40build:ui_bottom_3d.png?400|UI Board V1.7}}]  |
-\\+
 === Please read Errata carefully === === Please read Errata carefully ===
-Make sure to read the [[:ovi40build:batch1uiboarderrata|Errata]] carefully **before starting assembly.** + 
-\\ +Make sure to read the [[en:ovi40build:batch1uiboarderrata|Errata]] carefully **before starting assembly.** 
-=== IC Device Markings ===+ 
 +<code> 
 +  === IC Device Markings === 
 +</code> 
 The smaller ICs can be identified by device mark. The following device marks are used: The smaller ICs can be identified by device mark. The following device marks are used:
 +
 |< 45% 25% 25% 25% 25% >| |< 45% 25% 25% 25% 25% >|
 +
 |Typ  |Device Mark  |Schematic  |Purpose  | |Typ  |Device Mark  |Schematic  |Purpose  |
 |LP5907_Q1  |LLVB  |IC3  |LDO 3.3 V  | |LP5907_Q1  |LLVB  |IC3  |LDO 3.3 V  |
Line 40: Line 51:
 |BC857B  |3F  |T3  |Transistor| |BC857B  |3F  |T3  |Transistor|
 |BAS85  |Ring = Cathode|D7 - D9  |Diode  | |BAS85  |Ring = Cathode|D7 - D9  |Diode  |
-\\+
 === MCU STM32 "Pin 1" marking === === MCU STM32 "Pin 1" marking ===
-Please understand the correct orientation of STM32 MCU Pin 1. There are two markings on the IC. + 
-Please not the text printed on MCU to find the correct Pin 1: When reading the text Pin 1 is on bottom left corner.+Please understand the correct orientation of STM32 MCU Pin 1. There are two markings on the IC. Please not the text printed on MCU to find the correct Pin 1: When reading the text Pin 1 is on bottom left corner. 
 [{{:projekte:ovi40-sdr:ui-i40-cpu.jpg?400| Orientation of TXCO & MCU (photo DF9EH)}}] [{{:projekte:ovi40-sdr:ui-i40-cpu.jpg?400| Orientation of TXCO & MCU (photo DF9EH)}}]
-\\ + 
-=== STM32F76X_ZIT vs. STM32H743ZIT6 === +<code> 
-The kit is shipped with STM32F76X_ZIT ("F7"). The just released STM32H743ZIT6 ("H7") may be used instead.  +  === STM32F76X_ZIT vs. STM32H743ZIT6 === 
-It is suggested to use the F7 for now. Rwason: it is planned to support the H7 in the UHSDR, but no boot loader oder firmware is released for the H7 at the moment.+</code> 
 + 
 +The kit is shipped with STM32F76X_ZIT ("F7"). The just released STM32H743ZIT6 ("H7") may be used instead. It is suggested to use the F7 for now. Rwason: it is planned to support the H7 in the UHSDR, but no boot loader oder firmware is released for the H7 at the moment.
  
 Comparison of MCUs: Comparison of MCUs:
  
 |< 90% 25% 25% 25% 25% >| |< 90% 25% 25% 25% 25% >|
 +
 |   |mcHF:  |OVI40:  |OVI40 - future:  | |   |mcHF:  |OVI40:  |OVI40 - future:  |
 |   |STM32F407VET6|STM32F767ZIT6|STM32H743ZIT6  | |   |STM32F407VET6|STM32F767ZIT6|STM32H743ZIT6  |
Line 61: Line 76:
 |Pins  |100  |144  |144  | |Pins  |100  |144  |144  |
 |DMIPS  |210  |462  |856  | |DMIPS  |210  |462  |856  |
-\\+
 === EEPROM IC7 orientation === === EEPROM IC7 orientation ===
 +
 [{{:ovi40test:ic7_einbau.jpg?400|EEPROM IC7 position (photo DF9EH)}}] [{{:ovi40test:ic7_einbau.jpg?400|EEPROM IC7 position (photo DF9EH)}}]
  
 This is where the dot is printed. Also the edge of the case is slanted near the 1-4 pins. See [[http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8828-SEEPROM-AT24CM02-Datasheet.pdf|here]] This is where the dot is printed. Also the edge of the case is slanted near the 1-4 pins. See [[http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8828-SEEPROM-AT24CM02-Datasheet.pdf|here]]
-\\+ 
 +[{{:fr:ovi40build:20180211_144354_2.jpg?400|IC7 close-up}}] 
 + 
 +**Do not solder in R101** for the EEPROM delivered with the kit (AT24CM02). 
 === Prevent short cut with back up battery holder === === Prevent short cut with back up battery holder ===
-One of the connection pins of the battery holder might touch ground connection of a rotary encoder. Make sure to cut this pin flush with PCB surface **before soldering** - see photo:+ 
 +One of the connection pins of the battery holder might touch ground connection of a rotary encoder. Make sure to cut this pin flush with PCB surface **before soldering**  - see photo: 
 [{{:projekte:ovi40-sdr:batt_halter.jpg?400|Potential Shortcut (photo DF9EH)}}] [{{:projekte:ovi40-sdr:batt_halter.jpg?400|Potential Shortcut (photo DF9EH)}}]
-\\+
 === Polarised capacitors === === Polarised capacitors ===
 +
 Please observe mounting orientation of tantal and electrolytic capacitors. Markings on the capacitors are explained [[http://elektroniktutor.de/bauteilkunde/c_smdcod.html|http://elektroniktutor.de/bauteilkunde/c_smdcod.html|here]] Please observe mounting orientation of tantal and electrolytic capacitors. Markings on the capacitors are explained [[http://elektroniktutor.de/bauteilkunde/c_smdcod.html|http://elektroniktutor.de/bauteilkunde/c_smdcod.html|here]]
-\\ 
  
 === Mounting locations of switches S7 and S8 === === Mounting locations of switches S7 and S8 ===
 +
 Two different mounting locations are provided on the UI PCB for S7 and S8: Two different mounting locations are provided on the UI PCB for S7 and S8:
 +
   * "mcHF style": S7 and S8 not line with switches under LCD - they are mounted slightly higher   * "mcHF style": S7 and S8 not line with switches under LCD - they are mounted slightly higher
   * "OVI40 style": S7 and S8 are mounted in line with the function keys under the LCD   * "OVI40 style": S7 and S8 are mounted in line with the function keys under the LCD
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 "In line" is the preferred mounting location for S7 and S8. "In line" is the preferred mounting location for S7 and S8.
  
 +=== IC9 und IC11: leave empty for now ===
 +IC9 (SPI FRAM) and IC11 (SPI FLASH) are for future use. Please leave empty for now. They are neither required nor supported by UHSDR at this time.
  
- +==== Device Electronic Signature ==== 
 +=== STM32F76xxx === 
 +  * 0x111: STM32F767 and STM32F777 LQFP208 and TFBGA216 package 
 +  * 0x110: STM32F769 and STM32F779 LQFP208 and TFBGA216 package 
 +  * 0x101: STM32F767 and STM32F777 LQFP176 package 
 +  * 0x100: STM32F769 and STM32F779 LQFP176 package 
 +  * 0x011: WLCSP180 package 
 +  * 0x010: LQFP144 package 
 +  * 0x001: LQFP100 package 
 +  * 0x000: Reserved 
 +\\ 
 +=== STM32H7x3 MCUs: === 
 +  * 0000: LQFP100 (STM32H7x3) 
 +  * 0010: TQFP144 (STM32H7x3) 
 +  * 0101: TQFP176/UFBGA176 (STM32H7x3) 
 +  * 1000: LQFP208/TFBGA240 (STM32H7x3)
  
 ==== Modifications ==== ==== Modifications ====
  
 === Temporary Modification: Resistor in parallel to C94 === === Temporary Modification: Resistor in parallel to C94 ===
-Symptom: In stand-by the current drawn from back-up battery is excessively high. + 
-Work-around: Put resistor in parallel to C94. Start with a value of 56k - this seems to work in most cases. If board does not start increase value slightly.  +Symptom: In stand-by the current drawn from back-up battery is excessively high. Work-around: Put resistor in parallel to C94. Start with a value of 56k - this seems to work in most cases. If board does not start increase value slightly. The same approach is used BTW in the commercially available Disco F746 prototype board.  
-\\+
 === Change brightness of LEDs === === Change brightness of LEDs ===
-Helle LEDS: Mit den Bausatz-Vorwiderständen leuchten die LEDs sehr hell. DF9EH hat die Werte reduziert: + 
 +Helle LEDS: Mit den Bausatz-Vorwiderständen leuchten die LEDs sehr hell. DF9EH hat die Werte reduziert: 
   * R36 auf 22,6k (D1 grün)   * R36 auf 22,6k (D1 grün)
   * R37 auf 6,8k (D2 rot)   * R37 auf 6,8k (D2 rot)
   * R116 auf 6,8k (D3 blau)   * R116 auf 6,8k (D3 blau)
  
 +\\
  
  
  • en/ovi40build/uiboardbuild.txt
  • Last modified: 02.03.2018 18:13
  • by df9ts_user