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- | {{tag>stub}} | + | {{tag>english}}{{tag> |
===== Building the UI V1.8 Board ===== | ===== Building the UI V1.8 Board ===== | ||
- | ==== Unterlagen: | + | ==== OVI40 UI V1.7 Documents |
- | + | ||
- | UI V1.7 war die Beta Test Version der UI Platine. Es bestehen nur wenige Unterschiede zwischen V1.7 und V1.8 (der ausgelieferten Bausatz Platine). Die V1.7 Unterlagen sind deshalb interessant zum Vergleich und als Ergänzung. | + | |
- | + | ||
- | < | + | |
- | + | ||
- | OVI40 UI V1.7 Schaltbild: {{: | + | |
- | OVI40 UI PCB bottom layer: {{: | + | **UI V1.7 documents are provided for information only**. Please primarily use the V1.8 documents for building the UI V1.8 board. |
- | OVI40 UI PCB top layer: | + | * {{: |
+ | | ||
+ | * {{: | ||
- | ==== Unterlagen: OVI40 UI V1.8 ==== | + | Please note that the component placement docs are searchable pdf documents. During soldering they can be used to quickly find a component' |
- | Im Vergleich zur V1.7 UI kommt bei der UI V1.8 folgendes dazu: | + | ==== OVI40 UI V1.8 Documents ==== |
- | * unter dem Display ein weiterer zusätzlicher Taster | + | * {{: |
- | * die beiden STEP Taster unterm VFO können in zwei verschiedenen Positionen eingelötet werden. Entweder klassisch leicht nach oben versetzt wie beim mcHF oder tiefer und damit in einer Flucht mit den 6 Funktionstasten. | + | * [[en: |
- | + | | |
- | {{: | + | |
- | [[: | + | |
- | + | ||
- | BoM von F4HTX Francois mit Bauteiletütchen Nummern: | + | |
==== OVI40 UI V1.8 Kit Contents ==== | ==== OVI40 UI V1.8 Kit Contents ==== | ||
Line 30: | Line 23: | ||
The kit contains UI V1.8 PCB, components in bags and packing list. The display is delivered as assembled and tested unit. | The kit contains UI V1.8 PCB, components in bags and packing list. The display is delivered as assembled and tested unit. | ||
- | |[{{: | + | |< 60% 33% 33% 33% >| |
+ | |[{{: | ||
==== Assembly and Soldering ==== | ==== Assembly and Soldering ==== | ||
The graphics below - UI V1.7 with 3.2" Display - give an impression on how the finished V1.8 UI board will look like: | The graphics below - UI V1.7 with 3.2" Display - give an impression on how the finished V1.8 UI board will look like: | ||
+ | |||
|< 95% 50% 50% >| | |< 95% 50% 50% >| | ||
+ | |||
| [{{: | | [{{: | ||
- | \\ | + | |
=== Please read Errata carefully === | === Please read Errata carefully === | ||
- | Make sure to read the [[: | + | |
- | \\ | + | Make sure to read the [[en: |
- | === IC Device Markings === | + | |
+ | < | ||
+ | | ||
+ | </ | ||
The smaller ICs can be identified by device mark. The following device marks are used: | The smaller ICs can be identified by device mark. The following device marks are used: | ||
+ | |||
|< 45% 25% 25% 25% 25% >| | |< 45% 25% 25% 25% 25% >| | ||
+ | |||
|Typ |Device Mark |Schematic | |Typ |Device Mark |Schematic | ||
|LP5907_Q1 | |LP5907_Q1 | ||
Line 49: | Line 51: | ||
|BC857B | |BC857B | ||
|BAS85 | |BAS85 | ||
- | \\ | + | |
=== MCU STM32 "Pin 1" marking === | === MCU STM32 "Pin 1" marking === | ||
- | Please understand the correct orientation of STM32 MCU Pin 1. There are two markings on the IC. | + | |
- | Please not the text printed on MCU to find the correct Pin 1: When reading the text Pin 1 is on bottom left corner. | + | Please understand the correct orientation of STM32 MCU Pin 1. There are two markings on the IC. Please not the text printed on MCU to find the correct Pin 1: When reading the text Pin 1 is on bottom left corner. |
[{{: | [{{: | ||
- | \\ | + | |
- | === STM32F76X_ZIT vs. STM32H743ZIT6 === | + | < |
- | The kit is shipped with STM32F76X_ZIT (" | + | |
- | It is suggested to use the F7 for now. Rwason: it is planned to support the H7 in the UHSDR, but no boot loader oder firmware is released for the H7 at the moment. | + | </ |
+ | |||
+ | The kit is shipped with STM32F76X_ZIT (" | ||
Comparison of MCUs: | Comparison of MCUs: | ||
|< 90% 25% 25% 25% 25% >| | |< 90% 25% 25% 25% 25% >| | ||
+ | |||
| | | | ||
| | | | ||
Line 70: | Line 76: | ||
|Pins |100 |144 |144 | | |Pins |100 |144 |144 | | ||
|DMIPS | |DMIPS | ||
- | \\ | + | |
=== EEPROM IC7 orientation === | === EEPROM IC7 orientation === | ||
+ | |||
[{{: | [{{: | ||
This is where the dot is printed. Also the edge of the case is slanted near the 1-4 pins. See [[http:// | This is where the dot is printed. Also the edge of the case is slanted near the 1-4 pins. See [[http:// | ||
- | \\ | + | |
+ | [{{: | ||
+ | |||
+ | **Do not solder in R101** for the EEPROM delivered with the kit (AT24CM02). | ||
=== Prevent short cut with back up battery holder === | === Prevent short cut with back up battery holder === | ||
- | One of the connection pins of the battery holder might touch ground connection of a rotary encoder. Make sure to cut this pin flush with PCB surface **before soldering** - see photo: | + | |
+ | One of the connection pins of the battery holder might touch ground connection of a rotary encoder. Make sure to cut this pin flush with PCB surface **before soldering** | ||
[{{: | [{{: | ||
- | \\ | + | |
=== Polarised capacitors === | === Polarised capacitors === | ||
+ | |||
Please observe mounting orientation of tantal and electrolytic capacitors. Markings on the capacitors are explained [[http:// | Please observe mounting orientation of tantal and electrolytic capacitors. Markings on the capacitors are explained [[http:// | ||
- | \\ | ||
=== Mounting locations of switches S7 and S8 === | === Mounting locations of switches S7 and S8 === | ||
+ | |||
Two different mounting locations are provided on the UI PCB for S7 and S8: | Two different mounting locations are provided on the UI PCB for S7 and S8: | ||
+ | |||
* "mcHF style": | * "mcHF style": | ||
* "OVI40 style": | * "OVI40 style": | ||
Line 91: | Line 106: | ||
"In line" is the preferred mounting location for S7 and S8. | "In line" is the preferred mounting location for S7 and S8. | ||
+ | === IC9 und IC11: leave empty for now === | ||
+ | IC9 (SPI FRAM) and IC11 (SPI FLASH) are for future use. Please leave empty for now. They are neither required nor supported by UHSDR at this time. | ||
- | + | ==== Device Electronic Signature ==== | |
+ | === STM32F76xxx === | ||
+ | * 0x111: STM32F767 and STM32F777 LQFP208 and TFBGA216 package | ||
+ | * 0x110: STM32F769 and STM32F779 LQFP208 and TFBGA216 package | ||
+ | * 0x101: STM32F767 and STM32F777 LQFP176 package | ||
+ | * 0x100: STM32F769 and STM32F779 LQFP176 package | ||
+ | * 0x011: WLCSP180 package | ||
+ | * 0x010: LQFP144 package | ||
+ | * 0x001: LQFP100 package | ||
+ | * 0x000: Reserved | ||
+ | \\ | ||
+ | === STM32H7x3 MCUs: === | ||
+ | * 0000: LQFP100 (STM32H7x3) | ||
+ | * 0010: TQFP144 (STM32H7x3) | ||
+ | * 0101: TQFP176/ | ||
+ | * 1000: LQFP208/ | ||
==== Modifications ==== | ==== Modifications ==== | ||
=== Temporary Modification: | === Temporary Modification: | ||
- | Symptom: In stand-by the current drawn from back-up battery is excessively high. | + | |
- | Work-around: | + | Symptom: In stand-by the current drawn from back-up battery is excessively high. Work-around: |
- | \\ | + | |
=== Change brightness of LEDs === | === Change brightness of LEDs === | ||
- | Helle LEDS: Mit den Bausatz-Vorwiderständen leuchten die LEDs sehr hell. DF9EH hat die Werte reduziert: | + | |
+ | Helle LEDS: Mit den Bausatz-Vorwiderständen leuchten die LEDs sehr hell. DF9EH hat die Werte reduziert: | ||
* R36 auf 22,6k (D1 grün) | * R36 auf 22,6k (D1 grün) | ||
* R37 auf 6,8k (D2 rot) | * R37 auf 6,8k (D2 rot) | ||
* R116 auf 6,8k (D3 blau) | * R116 auf 6,8k (D3 blau) | ||
+ | \\ | ||